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25Q32FVSIG 3V, 32M-bit serial flash memory chip
The 25Q32FVSIG is a 32M-bit (4MB) 3V SPI flash memory chip offering fast read/write speeds and low power consumption for embedded and IoT applications.
The 25Q32FVSIG is a 32M-bit (4MB) serial flash memory chip designed for high-speed, reliable data storage in embedded and electronic systems. Manufactured by Winbond, this 3V SPI flash memory offers a balance of high performance, low power consumption, and compact design, making it ideal for a wide range of applications such as microcontroller storage, firmware, IoT devices, and consumer electronics.
It supports the Serial Peripheral Interface (SPI) protocol, ensuring fast data transfer rates up to 104 MHz in standard or dual/quad I/O modes. The 25Q32FVSIG provides uniform 4KB sectors, 32KB blocks, and 64KB block erase options for flexible data management, along with high endurance and data retention.
Housed in an 8-pin SOIC package, this flash memory chip is easy to integrate into compact circuit boards and development projects.
Key Features:
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Memory Density: 32M-bit (4MB)
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Operating Voltage: 2.7V – 3.6V
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Interface: SPI (Standard, Dual, and Quad I/O)
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Clock Frequency: up to 104 MHz
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Sector Erase: 4KB, 32KB, 64KB options
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Fast read/write speeds for embedded applications
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Low standby current for energy-efficient designs
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High endurance: 100,000 program/erase cycles
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Data retention: 20+ years
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Package: 8-pin SOIC

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WH0201102 ABS 1.75 mm 1 kg Filament-Wanhao
- Material: ABS
- Color: White
- Material Diameter: 1.75mm
- Printing Temperature: 220° to 230°C
- Roundness Accuracy: +/- 0.5mm +/- 0.5mm
- Density: 1.31g/cm3 1.01g/cm3
- Mounted: Spool Mounted
- Net weight: 1kg
- Packaging Vacuum-sealed with desiccant to protect the filament from humidity
- Highly Detailed & Quality Outputs.
- Tried and Tested by Makenica.com
- Compatible with any FDM 3D Printer.
- ABS is stronger than PLA
- Easy to post-process.
- Environment friendly – ISO 9001 and ROHS certified

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