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bi-directional logic level converter
Bi-directional logic level converter for safe 3.3V ↔ 5V signal translation in microcontroller projects.
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Tag: bi-directional logic level converter
Description
The Bi-Directional Logic Level Converter is designed to safely convert digital signals between different voltage logic levels, such as 3.3V and 5V, in both directions. It enables seamless communication between low-voltage and high-voltage devices without damaging sensitive components.
This module is commonly used to interface 3.3V microcontrollers (ESP32, ESP8266, Raspberry Pi, ARM boards) with 5V devices (Arduino, sensors, displays, SD cards, I²C and SPI modules). With automatic direction sensing and support for bidirectional data lines, it is ideal for I²C, UART, SPI, and general-purpose digital signals.
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Creality CR-5 Pro 3D PRINTER/300*325*380mm/multiple materials supported
• Print Size: 300*225*380mm
• Machine Size: 530*487*612mm
• Package Szie: 625*547*710mm
• Filament diameter: 1.75 mm PLA/ABS
• File Format: STL/OBJ/AMF
• Layer Heigh: 0.1-0.4mm
• Sicer software: Creality Slicer, Cura, Simplify3D, Repetier-Host
• Connectivity: Online/SD card
• Mainboard: ATmega2560 Silent board
• UI interface: 4.3inch touch screen
Serial LCD Driver
Text to Speech TTL Module (Serial to Speech)
-  Single row 0.1″ header for easy connection to a host system
- Power requirements: +5 VDC
- 30 mA idle
- 46-220 mA active (depending on speech parameters and output load)
- Â Communication: Asynchronous 9600 bps serial (8N1)
- Dimensions: 1.25″x1.5″x0.37″
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Text support rate is better
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 Interface operation is simpler
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5V single power supply.
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Output directly connected to the speaker, can drive 4 ohms 3W / 8 ohm 2W speakers
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Busy status output, can be connected to the microcontroller IO or indicator light, no need to be left floating.
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 Voice effect optimization
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 Module miniaturization and easy integration
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Dimension: 33*27.5mm
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With mounting holes
WH0201102 ABS 1.75 mm 1 kg Filament-Wanhao
- Material: ABS
- Color: White
- Material Diameter: 1.75mm
- Printing Temperature: 220° to 230°C
- Roundness Accuracy: +/- 0.5mm +/- 0.5mm
- Density: 1.31g/cm3 1.01g/cm3
- Mounted: Spool Mounted
- Net weight: 1kg
- Packaging Vacuum-sealed with desiccant to protect the filament from humidity
- Highly Detailed & Quality Outputs.
- Tried and Tested by Makenica.com
- Compatible with any FDM 3D Printer.
- ABS is stronger than PLA
- Easy to post-process.
- Environment friendly – ISO 9001 and ROHS certified

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