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PN532 NFC RFID Read/Write Module V3 Kit
PN532 NFC RFID Read/Write Module V3 Kit supporting I²C, SPI, and UART—ideal for Arduino, ESP32, access control, and NFC projects.
The PN532 NFC RFID Read/Write Module V3 Kit is a powerful and versatile contactless communication module based on the popular NXP PN532 chipset. It supports NFC, RFID read and write operations at 13.56 MHz, making it ideal for a wide range of identification, authentication, and data exchange applications.
This V3 kit supports multiple communication interfaces including I²C, SPI, and UART, allowing seamless integration with Arduino, ESP32, ESP8266, Raspberry Pi, STM32, and other microcontroller platforms. It is compatible with ISO/IEC 14443 Type A & B, MIFARE Classic, Ultralight, DESFire, and NFC Forum Type 1–4 tags.
The module supports peer-to-peer (P2P) communication, card emulation, and read/write modes, enabling advanced NFC applications such as smart access control, payment prototypes, attendance systems, and IoT authentication. The V3 kit typically includes onboard level shifting, antenna, and jumper options for easy setup and reliable performance.

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- Support wireless upgrade firmware
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- Built-in onboard antenna &Temperature and humidity sensor
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Text to Speech TTL Module (Serial to Speech)
- Single row 0.1″ header for easy connection to a host system
- Power requirements: +5 VDC
- 30 mA idle
- 46-220 mA active (depending on speech parameters and output load)
- Communication: Asynchronous 9600 bps serial (8N1)
- Dimensions: 1.25″x1.5″x0.37″
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Text support rate is better
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Interface operation is simpler
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5V single power supply.
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Output directly connected to the speaker, can drive 4 ohms 3W / 8 ohm 2W speakers
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Busy status output, can be connected to the microcontroller IO or indicator light, no need to be left floating.
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Voice effect optimization
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Module miniaturization and easy integration
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Dimension: 33*27.5mm
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With mounting holes
WH0201102 ABS 1.75 mm 1 kg Filament-Wanhao
- Material: ABS
- Color: White
- Material Diameter: 1.75mm
- Printing Temperature: 220° to 230°C
- Roundness Accuracy: +/- 0.5mm +/- 0.5mm
- Density: 1.31g/cm3 1.01g/cm3
- Mounted: Spool Mounted
- Net weight: 1kg
- Packaging Vacuum-sealed with desiccant to protect the filament from humidity
- Highly Detailed & Quality Outputs.
- Tried and Tested by Makenica.com
- Compatible with any FDM 3D Printer.
- ABS is stronger than PLA
- Easy to post-process.
- Environment friendly – ISO 9001 and ROHS certified

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