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Sonoff IoT WiFi Development Board
Sonoff IoT WiFi Development Board – A compact, WiFi-enabled board ideal for IoT and smart home projects. Supports wireless control, easy programming, and seamless integration with sensors and automation systems.
Description
Sonoff IoT WiFi Development Board
The Sonoff IoT WiFi Development Board is a powerful and versatile solution for building smart automation and IoT projects. Designed for developers, students, and hobbyists, this board enables seamless wireless control and monitoring of devices through WiFi connectivity.
Built on a reliable microcontroller platform, the Sonoff development board supports integration with popular IoT platforms and mobile apps, making it ideal for smart home automation, remote switching, sensor monitoring, and prototype development. Its compact design, stable performance, and easy programming support allow quick deployment of custom IoT solutions.
Whether you are developing a smart switch, energy monitoring system, or cloud-connected device, the Sonoff IoT WiFi Development Board offers flexibility, efficiency, and scalability for real-world applications.
Key Features
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Built-in WiFi module for wireless connectivity
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Ideal for IoT, smart home, and automation projects
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Supports cloud-based and app-based control
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Easy to program and integrate with sensors & modules
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Compact, reliable, and developer-friendly design
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- Support 802.11b / n / g wireless standard
- Independent development MCU platform
- High cost performance
- Support UART / GPIO data communication interface
- Support STA / AP / STA + AP coexistence mode of operation
- Support SmartLink intelligent networking (APP)
- Support wireless upgrade firmware
- Support WPS network configuration
- Built-in onboard antenna &Temperature and humidity sensor
- RGB three-color light adjustable
- Provide rich AT command set configuration
- Free AiCloud cloud service for debugging
- 3 AA batteries / 5V adapter power supply
- Size: 61.6mm x 56.2mm;
WH0201102 ABS 1.75 mm 1 kg Filament-Wanhao
- Material: ABS
- Color: White
- Material Diameter: 1.75mm
- Printing Temperature: 220° to 230°C
- Roundness Accuracy: +/- 0.5mm +/- 0.5mm
- Density: 1.31g/cm3 1.01g/cm3
- Mounted: Spool Mounted
- Net weight: 1kg
- Packaging Vacuum-sealed with desiccant to protect the filament from humidity
- Highly Detailed & Quality Outputs.
- Tried and Tested by Makenica.com
- Compatible with any FDM 3D Printer.
- ABS is stronger than PLA
- Easy to post-process.
- Environment friendly – ISO 9001 and ROHS certified
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