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STMicroelectronics NUCLEO-F756ZG development board
The NUCLEO-F756ZG is a high-performance STM32 Nucleo-144 board with a 216 MHz ARM Cortex-M7 MCU, 1 MB Flash, Ethernet, and USB OTG—ideal for advanced embedded projects.
The STMicroelectronics NUCLEO-F756ZG Development Board is a powerful and feature-rich STM32 Nucleo-144 board based on the STM32F756ZG microcontroller, which integrates an ARM® Cortex®-M7 core running at 216 MHz. Designed for high-speed embedded development, it offers exceptional performance, advanced connectivity, and broad compatibility, making it ideal for IoT, industrial control, signal processing, and embedded system applications.
Equipped with Ethernet, USB OTG, and extensive I/O options, the NUCLEO-F756ZG enables rapid prototyping and testing for complex applications. The board supports both Arduinoâ„¢ Uno V3 and ST morpho connectors, providing hardware flexibility for shields and expansion boards. With its integrated ST-LINK/V2-1 debugger/programmer, users can easily program and debug without external tools.
The NUCLEO-F756ZG is fully supported by STM32CubeMX, STM32CubeIDE, Keil MDK, IAR EWARM, and the STM32duino ecosystem—making development efficient, flexible, and beginner-friendly.
Key Features:
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Microcontroller: STM32F756ZG (ARM Cortex-M7 @ 216 MHz)
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Flash Memory: 1 MB
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SRAM: 320 KB
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Operating Voltage: 3.3 V (5 V tolerant I/O)
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Connectivity Options:
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USB OTG FS
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Ethernet (RJ45 with integrated PHY)
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USART, I²C, SPI, CAN, I²S
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ADC/DAC, Timers, PWM
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On-board Debugger/Programmer: ST-LINK/V2-1 (USB interface)
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Connectors: Arduino Uno V3 + ST morpho (extended headers)
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Power Supply: USB VBUS (5 V) or external (VIN, E5V)
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Form Factor: Nucleo-144 (large form factor)
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Software Support: STM32CubeIDE, STM32CubeMX, Keil, IAR, Arduino IDE
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Operating Temperature: –40°C to +85°C

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WH0201102 ABS 1.75 mm 1 kg Filament-Wanhao
- Material: ABS
- Color: White
- Material Diameter: 1.75mm
- Printing Temperature: 220° to 230°C
- Roundness Accuracy: +/- 0.5mm +/- 0.5mm
- Density: 1.31g/cm3 1.01g/cm3
- Mounted: Spool Mounted
- Net weight: 1kg
- Packaging Vacuum-sealed with desiccant to protect the filament from humidity
- Highly Detailed & Quality Outputs.
- Tried and Tested by Makenica.com
- Compatible with any FDM 3D Printer.
- ABS is stronger than PLA
- Easy to post-process.
- Environment friendly – ISO 9001 and ROHS certified

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