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ESP32-C3 SuperMini Development Board
Specifications:
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Processor: ESP32-C3 RISC-V 32-bit
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Connectivity: Wi-Fi 2.4 GHz, Bluetooth 5 (BLE)
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Interface: USB-C
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Operating Voltage: 3.3V
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Development Support: Arduino IDE, ESP-IDF, MicroPython
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GPIOs: Multiple for sensors & modules
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Dimensions: Ultra-compact SuperMini
Ideal For:
IoT projects, robotics, smart devices, embedded system prototyping, and wireless automation.
ESP32-C3 SuperMini Development Board
The ESP32-C3 SuperMini Dev Board is a compact, powerful microcontroller board designed for IoT, embedded systems, and wireless automation projects. Powered by the ESP32-C3 RISC-V 32-bit processor, it delivers reliable Wi-Fi and Bluetooth 5 (BLE) connectivity in an ultra-small form factor—perfect for space-constrained applications.
This board supports USB-C programming, making development fast and convenient without external programmers. With low power consumption and strong security features, the ESP32-C3 SuperMini is ideal for smart devices, sensors, robotics, home automation, and industrial IoT projects.
Key Features
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ESP32-C3 RISC-V 32-bit single-core processor
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Built-in 2.4 GHz Wi-Fi and Bluetooth 5 (BLE)
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Ultra-compact SuperMini design
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USB-C interface for programming & power
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Low power consumption for battery-powered projects
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Supports Arduino IDE, ESP-IDF & MicroPython
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Multiple GPIOs for sensors, modules & peripherals
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On-chip security features for IoT applications
Applications
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IoT & Smart Home Devices
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Robotics & Automation Projects
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Wireless Sensor Networks
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Embedded System Prototyping
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Wearables & Portable Electronics

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- Bluetooth module HC-08 Master and slave Two in one module.
- Use the CSR mainstream Bluetooth chip, Bluetooth V2.0 protocol standards.
- Potter default rate of 9600, the user can be set up.
- Bluetooth protocol: Bluetooth Specification v2.0+EDR
- Speed: Asynchronous: 2.1Mbps(Max) / 160 kbps, Synchronous: 1Mbps/1Mbps.
- Security: Authentication and encryption.
- Profiles: Bluetooth serial port.
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WH0201102 ABS 1.75 mm 1 kg Filament-Wanhao
- Material: ABS
- Color: White
- Material Diameter: 1.75mm
- Printing Temperature: 220° to 230°C
- Roundness Accuracy: +/- 0.5mm +/- 0.5mm
- Density: 1.31g/cm3 1.01g/cm3
- Mounted: Spool Mounted
- Net weight: 1kg
- Packaging Vacuum-sealed with desiccant to protect the filament from humidity
- Highly Detailed & Quality Outputs.
- Tried and Tested by Makenica.com
- Compatible with any FDM 3D Printer.
- ABS is stronger than PLA
- Easy to post-process.
- Environment friendly – ISO 9001 and ROHS certified

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