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IR2155 Self-Oscillating Half-Bridge Driver IC
- Self-Oscillating Half-Bridge Driver
- High Side Floating Supply Voltage Max.: 625V
- Supply current Max.: 5mA
- Clamp Voltage Max.: 16.8V
- High level output voltage Max.: 100mV
- Low level output voltage Max.: 100mV
- Total Power Dissipation: 1W
- Oscillator frequency Max.: 106kHz
- Rise Time Max.: 120ns
- Fall Time Max.: 70ns
- Package: DIP-8
The IR2155 designed as a self oscillating high voltage, high-speed power MOSFET and IGBT driver comprises of dependent high and low side referenced output channels designed explicitly for half-bridge applications. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. The front end features a programmable oscillator which is similar to the 555 timer.
The output drivers provides a high pulse current buffer stage designed for minimum driver cross-conduction. Internal deadtime employed to avoid shoot-through in the output half-bridge. Propagation delays for the two channels are matched to simplify use in 50% of duty cycle applications. The floating channel used to drive an Nchannel power MOSFET/IGBT in high side configuration which operates up to 600 volts. Meanwhile, it offers a Gate drive supply voltage at a range from 10 to 20V. Moreover, this gate driver IC features an Undervoltage lockout for both channels. IR2155 Half-Bridge Driver IC manufactured in 8 pin-Lead PDIP or 8-Lead SOIC package.
The Half-Bridge Driver IC employed to drive the gates of high- and low-side N-channel MOSFETs (or IGBTs) with a low output impedance to reduce the conduction losses, and a fast switching time to reduce the switching losses. The high-and low-side drivers requires very close matching of the timing characteristics. Thus allow accurate and efficient switching of the device. This minimises the deadtime from one switch of the half-bridge turning off before the second switch turns on. Isolated half-bridge gate drivers+ widely utilized in many applications that range from isolated dc-to-dc power supply modules where high power density and efficiency are necessary, to solar inverters where high isolation voltage and long-term reliability are mandatory.

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- Wavelength: 940nm wavelength (most commonly used)
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- Soldering Temperature should not exceed 260 ℃
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